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| datashee t 1 / 32 tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 bd8664gw bd8665gw bd8668gw vbus isns sw1 sw2 vfb isetin1 gnd pgood icomp isetin2aclen vbuslim s y s t e m b a t t e r y + v b u s + fset host pgnd vcomp isetin3 en fset vbusok isetout1 isetout2 ovp bc1.2 detector sda scl controled by host d + d - battery charger ic series boost dc/dc charger with input current limiter bd8664gw bd8665gw bd8668gw general description bd8664gw, bd8665gw and bd8668gw are lithium-ion battery charger ic s , suitable for charging 2s batter ies from a 5v source, such as a usb port with dc/dc boost topology. features ? cp/cv charging ? charge-on/ off control available with en pin ? integrated input detection (vbusok) ? integrated power g ood ? boost switching t opology ? low ron integrated mosfet ? output short circuit protection ? 0.4mm pitch chip scale package (ucsp75m2) applications dvc , dsc , mid and other lithium battery-powered portable devices key specifications ? input current accuracy 2%(bd8664gw) 3%(bd8665gw/bd8668gw) ? charging voltage accuracy 0.5% ? selectable input current 100ma/500ma/900ma/1500ma (max) ? charging frequency 1mhz (typ) ? input standby current 71a (typ) ? battery leakage current while charging is off 0a (typ) package w(typ) x d(typ) x h(max) ucsp75m2 2.20mm x 2.20mm x 0.85 mm line up charge voltage package pin number orderable part number 8.30v uscp75m2 20 bd8664gw 8.40v bd8665gw 25 bd8668gw typical application circuit product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ray s figure 1. typical application circuit downloaded from: http:///
2 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 contents general description ...................................................................................................................................................................... 1 features ......................................................................................................................................................................................... 1 applications .................................................................................................................................................................................. 1 key specifications ........................................................................................................................................................................ 1 package w(typ) x d(typ) x h(max) ................................................................................................................................ . 1 line up ........................................................................................................................................................................................... 1 typical application circuit ........................................................................................................................................................... 1 pin configuration (top view) ..................................................................................................................................................... 3 pin description ............................................................................................................................................................................. 3 block diagram ............................................................................................................................................................................... 5 absolute maximum ratings (ta=25c) ....................................................................................................................................... 6 recommended operating conditions (ta=-30 to +85c) ........................................................................................................... 6 electrical characteristics ............................................................................................................................................................. 7 typical performance curves ........................................................................................................................................................ 9 reference data ............................................................................................................................................................................ 14 bl ock descriptions ..................................................................................................................................................................... 16 timing chart/application information ....................................................................................................................................... 18 application components selection ........................................................................................................................................... 21 example of recommended circuit ............................................................................................................................................ 22 input/output pin immediate circuit ........................................................................................................................................... 23 thermal reduction characteristics .......................................................................................................................................... 25 operational notes ....................................................................................................................................................................... 26 ordering information .................................................................................................................................................................. 28 marking diagrams ....................................................................................................................................................................... 28 physical dimensions, tape and reel information ................................................................................................................... 29 revision history ......................................................................................................................................................................... 32 downloaded from: http:/// 3 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 a b c d e 1 2 3 4 5 en vbus isns pgood vbuslim icomp vbus ok isetin 1 isetin 3 fset sw1 vcomp isetin 2 iset out2 pgnd aclen gnd iset out1 vfb sw2 pin configuration (top view) pin description bd8664gw / bd8665gw no. name i/o description a1 en i charging on/off a2 vbus i power input a3 isns i current sensing a4 pgood o power good output a5 vbuslim o vbus current limiter output b1 icomp o pin for phase compensation of constant current b2 vbusok o vbusok output b3 - - - b4 isetin1 i current setting pin1 b5 isetin3 i current setting pin3 c1 fset i frequency setting pin c2 - - - c3 - - - c4 - - - c5 sw1 o inductor connection pin1 d1 vcomp o pin for phase compensation of constant current connection d2 isetin2 i current setting pin2 d3 - - - d4 isetout2 o current setting output2 d5 pgnd i power gnd(0.0v) e1 aclen i automatic current on/off selection pin e2 gnd i gnd(0.0v) e3 isetout1 o current setting output 1 e4 vfb i feedback pin of cv charging voltage e5 sw2 o inductor connection pin2 no upper esd protection diodes are connected to isetin1, isetin2, iset in3, and en. a b c d e 1 2 3 4 5 vbus vbus isns pgood vbuslim icomp en isetin 3 vbus ok sw1 fset isetin 1 isetin 2 iset out2 pgnd gnd gnd vcomp vfb sw2 aclen gnd gnd vfb iset out1 bd8668gw bd8664gw / bd8665gw downloaded from: http:/// 4 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 pi n description C continued bd8668gw no. name i/o description a1 vbus i power input a2 vbus i power input a3 isns i current sensing a4 pgood o power good output a5 vbuslim o vbus current limiter output b1 icomp o pin for phase compensation of constant current b2 en i charging on/off b3 isetin3 i current setting pin3 b4 vbusok o vbusok output b5 sw1 o inductor connection pin1 c1 fset i frequency setting pin c2 isetin1 i current setting pin1 c3 isetin2 i current setting pin2 c4 isetout2 o current setting output2 c5 pgnd i power gnd (0.0v) d1 gnd i gnd (0.0v) d2 gnd i gnd (0.0v) d3 vcomp o pin for phase compensation of constant current connection d4 vfb i feedback pin of cv charging voltage d5 sw2 o inductor connection pin2 e1 aclen i automatic current on/off selection pin e2 gnd i gnd (0.0v) e3 gnd i gnd (0.0v) e4 vfb i feedback pin of cv charging voltage e5 isetout1 o current setting output 1 no upper esd protection diodes are connected to isetin1, isetin2, iset in3, and en. downloaded from: http:/// 5 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 i s e t i n 1 i s e t i n 3 ( g n d ) v f b v b u s l i m v b u s f s e t p g n d s w 2 ( v f b ) d r i v e r o s c i l l a t o r 5 0 0 k h z 2 m h z e n v b u s o k p g o o d i c o m p s w 1 a c l e n c v e r r o r a m p l i f i e r c p / c v c o n t r o l internal reg v c o m p r e f e r e n c e v o l t a g e c o n t r o l c p e r r o r a m p l i f i e r o n / o f f r a m p u p b y v b u s vbuslim soft-start ends 50msec after charging starts i s n s ( v b u s ) i s e t i n 2 level shifter i s e t o u t 1 i s e t o u t 2 i n t e r n a l r e g 3 v n p o c p l o a d s w p 2 0 0 m a 1 m s e c s c p d e t e c t i o n 2 . 6 v 2 0 ( t y p ) g n d p ( g n d ) ( g n d ) ( ) : nc in bd8665. block diagram figure 2. block diagram downloaded from: http:/// 6 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings (ta= 25c ) item symbol range unit vbus voltage v vbu s - 0. 3 to +7.0 v vbuslim voltage v vbuslim -0.3 to vbus+0.3 (note 3) v vfb voltage v v fb -0.3 to +13.0 v sw1 voltage v s w1 -0.3 to vbuslim+0.3 (note 4) v sw2 voltage v s w2 -0.3 to vfb+0.3 v terminal voltage 1 (note 1) v in out1 -0.3 to vbus+0.3 (note 3) v terminal voltage 2 (note 2) v in out2 -0.3 to +6.0 v voltage between terminals (note 5) v in out3 -0.3 to +0.3 v maximum power dissipation (note 6) pd 1.00 w operating temperature topr - 30 to + 85 c storage temperature tstg - 55 to + 150 c junction temperature tjmax + 150 c (note 1) isns, fset, vbusok, pgood, vcomp, icomp, isetout1, isetout2 (note 2) aclen, en, isetin1, isetin2, isetin3 (note 3) 7.0v against gnd (note 4) 7.0v against pgnd (note 5) gnd-pgnd, vbus-isns (note 6) when mounted on 54mm x 62 mm pcb. pd decreases by 8mw per 1 c when ta is 25c or higher. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is importa nt to consider circuit protection measures, such as adding a fuse , in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-30 to +85 c ) item symbol value unit part no. min typ max vbus voltage v vbu s 4.1 5.0 5.5 v - vfb voltage v v fb 0.0 8.4 10.0 v bd8665gw/bd8668gw 8.3 bd8664gw downloaded from: http:/// 7 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd=pgnd=0v ta=25 c) item symbol value unit conditions min typ max vbus stand-by current i vbus1 - 71 142 a v en = 0.0v, only vbusok is on vbus operational current i vbus2 - 2 5 ma no switching battery stand-by current i batt1 -1 0 +1 a v en = 0.0v battery operational current i batt2 - 60 120 a no switching frequency 1 f osc1 0.9 1.0 1.1 mhz r fset = 47 k frequency 2 f osc2 (1.8) 2.0 (2.2) mhz r fset = 22 k fset output voltage v fset - 0.6 - v 8 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 electrical characteristics - continued en/isetin1,2,3/aclen l voltage v inl - - 0.4 v en/isetin1,2,3/aclen h voltage v inh 2.5 - 5.5 v isetin1,2 input current i inh - 0 - a no pull-down, open is not allowed. en/aclen/isetin3 p ull -d own resistor r in2 300 500 700 k isetout1,2 l voltage v outl - 0.0 - v isetout1,2 h voltage v outh 2.94 3.00 3.06 v this product has no designed protection against radioactive rays. pd is the maximum power. please keep the current to meet power lower th an the pd. downloaded from: http:/// 9 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd=pgnd=0v ta=25 c) figure 5. start-up waveform (vfb is shorten to ground) v v fb 2.0v/div. i vbus 0.2a/div. v ic omp 0.5v/div. 10ms/div. figure 6. chargin g m ode start- up (1 00 ma mode) 10ms/div. v vfb 2.0v/div. i vbus 0.1a/div. v ic omp 0.5v/div. figure 4. feeding m ode ramp- up (50 load) 10ms/div. v v fb 2.0v/div. i vbus 0.5a/div. v ic omp 0.5v/div. figure 3. feeding m ode ramp- up (n o l oad) 10ms/div. i vbus 0.5a/div. v ic omp 0.5v/div. v v fb 2.0v/div. downloaded from: http:/// 10 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd=pgnd=0v ta=25 c) v v fb 2.0v/div. i vbus 0.5a/div. v ic omp 0.5v/div. v v fb 2.0v/div. i vbus 0.5a/div. v icomp 0.5v/div. 10ms/div. 1ms/div. figure 9. charging mo de start- up (1 5 00 ma m ode) figure 10. changing current (100 ma to 500ma) figure 8. charging m ode start- up (900ma m ode) 10ms/div. v v fb 2.0v/div. i vbus 0.5a/div. v ic omp 0.5v/div. figure 7. charging m ode start- up (5 00 ma m ode) 10ms/div. v v fb 2.0v/div. i vbus 0.5a/div. v ic omp 0.5v/div. downloaded from: http:/// 11 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd=pgnd=0v ta=25 c) v v fb 2.0v/div. i vbus 0.5a/div. v icomp 0.5v/div. 1ms/div. figure 13 . changing current (100ma to 1500ma) v v fb 2.0v/div. i vbus 0.5a/div. v icomp 0.5 v/ div. 1ms/div. figure 14 . changing current (1500ma to 500ma) 1ms/div. figure 11 . changing current (500ma to 900ma) v v fb 2.0v/div. i vbus 0.5a/div. v icomp 0.5v/div. 1ms/div. figure 12 . changing current (900ma to 1500ma) v v fb 2.0v/div. i vbus 0.5a/div. v icomp 0.5v/div. downloaded from: http:/// 12 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd=pgnd=0v ta=25 c) v vfb 2.0v/div. i vbus 0.5a/div. v icomp 0.5v/div. 5ms/div. figure 15 . changing current (1500 ma to 100ma) 20 ms/div. figure 16 . automatically changing current (1500ma to 900ma) v isetout2 5.0v/div. v vbus 2.0v/div. v isetout1 5.0v/div. i vbus 0.5a/div. v en 10 v/div. 20 ms/div. figure 17 . automatically changing current (900ma to 500ma) v isetout2 5.0v/div. v vbus 2.0v/div. v isetout1 5.0v/div. i vbus 0.5a/div. v en 10 v/div. 20 ms/div. figure 18 . automatically changing current (500ma to 100ma) v isetout2 5.0v/div. v vbus 2.0v/div. v isetout1 5.0v/div. i vbus 0.5a/div. v en 10 v/div. downloaded from: http:/// 13 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 typical performance curves - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd=pgnd=0v ta=25 c) v vbus 2.0v/div. v vbusok 1.0v/div. 10ms/div. figure 19. vbusok (l to h d elay time) downloaded from: http:/// 14 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd=pgnd=0v ta=25 c ) 47.0 47.5 48.0 48.5 49.0 49.5 50.0 -30 -15 0 15 30 45 60 75 90 temperature[] vbus-isns voltage [mv] 4.1v 5.0v 5.5v figure 20 . cv voltage vs temperature 47.0 47.5 48.0 48.5 49.0 49.5 50.0 -30 -15 0 15 30 45 60 75 90 temperature[] vbus-isns voltage[mv] figure 23. 500ma m ode cp current temperature characteristic 8.36 8.38 8.40 8.42 8.44 -30 -15 0 15 30 45 60 75 90 temperature[] vfbvoltage[v] 4.1v 5.0v 5.5v figure 22. cv voltage vbus voltage dependency (bd8665gw/bd8668gw) figure 21 . cv voltage vbus voltage dependency (bd8664gw) 8.26 8.28 8.30 8.32 8.34 -30 -15 0 15 30 45 60 75 90 temperature[] vfb voltage[v] 4.1v 5.0v 5.5v downloaded from: http:/// 15 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 reference data - continue ( unless otherwise specified, v vbus =5.0v v vfb =7.4v v isetin1,2,3 =0v gnd=pgnd=0v ta=25 c) 2.94 2.96 2.98 3.00 3.02 3.04 3.06 -30 -15 0 15 30 45 60 75 90 temperature[] pgood voltage[v] figure 25. pgood p in h voltage temperature characteristic 0 10 20 30 40 50 60 70 80 90 100 0.001 0.01 0.1 1 load[a] efficiency[%] figure 27. efficiency 500ma m ode 47.0 47.5 48.0 48.5 49.0 49.5 50.0 -30 -15 0 15 30 45 60 75 90 temperature[] vbus-isns voltage[mv] 4.1v 5.0v 5.5v figure 24. 500ma m ode cp current vbus dependency 0.90 0.95 1.00 1.05 1.10 -30 -15 0 15 30 45 60 75 90 temperature[] requency[mh] figure 26. frequency temperature characteristic downloaded from: http:/// 16 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 block descriptions 1. vb u s input detection comparator output (vbusok) vbus voltage can set vbus ok . 40ms after detecting that vbus is higher than 4.0v (typ), vbusok turns h (3 .0v [typ]). in case vbus ramps down, and reaches 3.9v (typ), vbusok turns l witho ut any delay. the function works independently from the condition of en and thermal shut down . vbus vbusok < 3.9v (typ) l 0.0v (typ) >= 4.0v (typ) h 3.0v (typ) 2. charging on/off (en) on/off is controlled with the en pin. when en is l, the ic enters sh utdown mode (or usb suspend mode), the battery leakage current is set to 0a , and all other functions but vbusok turns off. en pin is conne cted to a 500k (typ) pull -down resistor. 3. usb current setting (isetin1,2,3) iset1 iset2 iset3 vbus input current settings l l l 100ma (max) l l h 500ma (max) l h l 500ma (m ax) l h h 500ma (max) h l l 900ma (max) h l h 900ma (max) h h l 1500ma (max) h h h 1500ma (max) note: open is not allowed for isetin1,2 pins. no pull-down resistor is conne cted to isetin1, 2 pins. 500k (typ) pull-down resistor is internally connecte d to isetin3. 4. vbus current setting (isetout1,2) isetout1 isetout2 vbus current settings l l 100ma (max) l h 500ma (max) h l 900ma (max) h h 1500ma (max) note: 500k(typ) is connected internally to isetout1,2. even in the case v bus=0v, the output s tays stable. 5. frequency setting (fset) the pwm switching frequency can be set. fset pwm 100k 500khz (typ) 47k 1mhz (typ) 33k 1.5mhz (typ) 22k 2mhz (typ) 6. cv control soft-start if the system boots up with no battery, cv control method suppr esses the 8.3v (typ) in case of using bd8664gw and 8.4v (typ) in case of using bd8665gw/bd8668gw, on vfb pin, and enters feeding mode . in this mode , it will take 40ms (typ) for the vfb to reach 8.4v (typ ). 7. load switch function a pmos load switch is integrated between vbuslim and sw1. whe n en=l, the load switch turns off. if a low battery is connected, charging can be stopped. the integrated lo ad resistors are 20 (typ) and 70m (typ) . the higher resistance is connected during start-up. after 10ms (typ) , the lower resistance is connected i f no short circuit is detected by vfb pin. 8. ocp for load switch through a sense resistor between vbus and isns , over-current can be detected while the load switch is on . if the over-current is constantly detected for more than 1ms, the load switch turns off and latches, and pgood is set l. t o unlatch, the ic must be rebooted by switching e n to low , then back to high; or set vbus to a voltage lower than uvlo , then back to the operating vbus voltage. downloaded from: http:/// 17 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 9. battery low voltage detection (output scp) if during sta rt -up, the batterys voltage is lower than vfb voltage or the output is shorted to grou nd, the low-side load switch will never be turned on , and the high-side load switch will be on for 80ms (typ) . but, if the high-side load switch is kept on for more than 80ms, the load switch is turned off. this fun ction is off after the pgood is turned h. 10. power good (pgood) the ic is enabled by en pin. after cv, cp, and soft start, pgood condition changes its state from l to h. inversely , during thermal shutdown, overvoltage battery and ocp, pgoo d is l. 11. battery overvoltage detection due to the vbus current limiter, overvoltage can occur at vfb ter minal during cp charging . this can cause damage to devices that are connected to the ic . to prevent this, overvoltage protection is integrated . once overvoltage is detected, sw2 becomes hi-z, the error amp output and soft start are rese t to default, and pgood is set l. once vfb voltage is at a safe level, the ic automatically restarts with soft start. 12. auto vbus current setting once vbus voltage exceeds 4.1v (typ), the vbus current set to iset1 to 3 pins are automatically changed from 1500ma (max) to 900ma (max), from 900ma (max) to 500ma (max), a nd from 500ma (max) to 100ma (max), while vbus is continuously monitored. if iset1 to 3 are changed af ter the auto change is done, the initial current that has be en set to iset1 to 3 will be employed again. notes: (1) if vbus voltage remains lower than 4.1v and current is changed from 1500ma to 900ma, the current will not be changed to 500ma. (2) aclen has a pull-up resistor. the pin is l if it is open and auto setting beco mes active. (3) it can be turned off by setting aclen to h. (4) it starts to work after the lower resistance load is turned o n. until pgood is changed to h, the bus current value is determined only by isetin1 to 3 and will not to be changed by vfb low voltage function. 13. feeding mode and charging m ode feeding mode: if the system boots up with no battery to the ic, cv control metho d suppress es 8.3v (typ) for bd8664gw and 8.4v (typ) for bd8665gw/bd8668gw on vfb pin. during the fe eding mode, the constant voltage is done by the vfb pin. charging mode: if the system boots up with a battery to the ic , cp/cv control method is employed . during charging mode, the cv/cp function is applied to the battery. the two modes , however, are not internally controllable by the ic . an application that applies constant output voltage with cv charging is called feeding mode and another applicati on that charges with cv/ cp charging is called charging mode in this technical n ote. downloaded from: http:/// 18 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 timing chart/application information 1. vbusok/vbus threshold at automatic change current setting 3.6v(vbusuvlo ) 3.7v(vbusuvlo ) 3.9v(vbusok ) 4.0v(autocurrentlimit =vbusok ) 4.1v(autocurrentlimit ?? ) vbusok usb ?Q usb O vbus ?R figure 2 8. vbusok/vbus threshold at automatic change current setting waveform 1. start- up waveform at feeding mode (no battery, light load) vbusok vfb vbus pgood boost mode 8.4v en isetout 40msec(typ) 40msec(typ) 70msec(typ) 20 ohm load switch gate signal lower resistance load switch gate signal 10msec(typ) on off on off automatic change on usb current figure 2 9. start-up waveform at feeding mode 4.1v (threshold for auto current limit) 4.0v (threshold for auto current limit, current decreases at rising of vbus) vbusok set usb current automatic change on usb current vbus downloaded from: http:/// 19 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 2. start- up waveform at feeding mode (no b attery, 50 load) vfb 8.4v vbusok vbus pgood en isetout 40msec(typ) 40msec(typ) 70msec(typ) 10msec(typ) on off on off automatic change on usb current 20 ohm load switch gate signal lower resistance load switch gate signal boost mode figure 30. start-up waveform at feeding mode (no battery, 50 load) 3. start- up waveform at feeding mode(no battery, heavy load [short to ground ]) vout vbusok vbus pgood en isetout 40msec(typ) 80msec(typ) off off on off 20 ohm load switch gate signal lower resistance load switch gate signal figure 31. start-up waveform at feeding mode (no battery, heavy load [short to groun d]) v out downloaded from: http:/// 20 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 4. voltage w av eform to pgood at charging mode (with battery) vfb vbusok vbus pgood en isetout 40msec(typ) 40msec(typ) 70msec(typ) 10m sec(typ) on off on off vbus current 8.4v 20 ohm load switch gate signal lower resistance load switch gate signal automatic change on usb current figure 3 2. voltage waveform to pgood at charging mode (with battery) 5. operation from feeding mode t o charging m ode during feeding mode, after the output started up with 8.3v(typ) for bd8664gw and 8.4v(typ) for bd8665gw/bd8668gw , if the battery has to be connected and the mode has to change to charging mode, set en to l then h to enable cp charging. th is turns pgood pin to l then h. note that vbus current may exceed the set value unless the en is set l once. 6. operation from charging mode t o feeding mode during charging mode, if the mode has to change to feeding mod e, set the en to l, detach the battery , then set en to h again. this turns pgood pin to l, ramps up vfb to 8.3v (typ) for bd8664gw and 8.4v (typ) for bd8665gw/bd8668gw by feeding mode, and turns pgood to h, afterwards . note that the overcurrent protection may occur unless the en is set l like aforementioned vfb overvoltage detection waveform. 7. battery overvoltage detection waveform during charging, if the battery is detached by a user , v out will go higher as the mode changes to feeding mode. in this scenario, to prevent damage to devices connected to this ic, ovp is in tegrated. pgood has to be turned off to l when ovp is detected. soft-start is again implemented when v out goes low due to its output load. in the application circuit example, note that the vfb node goe s down to vbus -1vf , as determined by an external schottky diode. charging battery is detached ovp sw2=hiz v out ovp unlatched soft-start restart 8.4v (bd8665gw/bd8668gw) pgoo d 3.0v 8.3v (bd8664gw) figure 3 3. battery overvoltage detection waveform downloaded from: http:/// 21 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 8. precaution on voltage a ppli cation between constant-voltage charging voltage and ovp when the voltage between constant-voltage charging volta ge and ovp is applied to the vfb node , (e.g., an ac adapter is unplugged when the ac adapter voltage is applied to the vfb pin ), the vfb terminal drops drastically, so avoid the abov e mentioned condition. application components selection 1. frequency setting (fset ) resistor figure 33 frequency setting (f set ) resistor 2. inductor selection inductance for the boost switching affects its ripple curr ent and ripple current at feeding mode. the ripple voltage is inversely proportional to the inductance and switching fre quency so that the inductance must be higher if the frequ ency is lower. in other words, the inductance can be smaller if the frequency is higher. however, if the inductance changes, si nce the lc cutoff frequency changes, the phase compensation of icomp and vcomp may have to be changed. pwm inductance output capacitance icomp time constant vcomp coefficient 1mhz(typ) 4.7h 40f 200, 0.1f serial 47k, 0.1f serial if the external coefficient is changed from the designated va lue above , check the open-loop gain phase carefully. f set resistor [k ] figure 3 4. . frequency setting (f set ) resistor st??vsk? 100 1000 10000 10 100 1000 st??[k k?[khz] f set resistor vs frequency downloaded from: http:/// 22 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 example of recommended circuit figure 3 5. example of recommended circuit battery u s b ( v b u s ) b a t t + i n p u t c u r r e n t c o n t r o l 1 0 0 m a / 5 0 0 m a / 9 0 0 m a / 1 5 0 0 m a b a t t - 4 . 7 h 4 7 k 4 . 7 f 0 . 1 f c h a r g e o n / o f f 1 0 f 3.0v at start-up during chargingvbusok3.0v output 0.0v before start-up charging 0 . 1 f v b u s o k 3 . 0 v o u t p u t v b u s n g 0 . 0 v o u t p u t 1 0 0 m i s e t i n 1 i s e t i n 3 g n d v f b v b u s l i m v b u s f s e t p g n d s w 2 v f b d r i v e r o s c i l l a t o r 5 0 0 k h z 2 m h z e n v b u s o k p g o o d i c o m p s w 1 a c l e n c v e r r o r a m p l i f i e r c p / c v c o n t r o l internal reg v c o m p r e f e r e n c e v o l t a g e c o n t r o l c p e r r o r a m p l i f i e r o n / o f f r a m p u p b y v b u s vbuslim soft-start ends 50msec after charging starts i s n s v b u s i s e t i n 2 level shifter i s e t o u t 1 i s e t o u t 2 0 . 1 f 4 7 k 2 0 0 i n t e r n a l r e g 3 v v b u s l i m s y s t e m 0 . 1 f 0 . 1 f n p o c p l o a d s w p 2 0 0 m a 1 m s e c s c p d e t e c t i o n 2 . 6 v 2 0 ( t y p ) g n d g n d g n d 4 7 r b 0 7 0 m - 3 0 p 3 0 f h o s t downloaded from: http:/// 23 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 i nput /o utput pin immediate circuit pin no. (bd8668gw) pin name pin immediate circuit function a1/a2 vbus usb power input a5 vbu slim usb current limiter d1/d2 /e2/e3 gnd ground c5 pgnd power ground a3 isns current detection amp input a4 b4 c4 e5 pgood vbusok isetout2 isetout1 logic output (with pull-down resistor) b1 d3 icomp vcomp error amp output b2 e1 b3 en aclen isetin3 logic input (with pull-down resistor) gnd (sub) pgnd vbus vbuslim vbus isns gnd gnd vbus vbuslim gnd vbuslim 500k typ. 3v ref vbuslim gnd 500k typ. downloaded from: http:/// 24 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 input/output pin immediate circuit - continued pin no. (bd8668gw) pin name pin immediate circuit function c2 isetin1 logic input (without pull-down resistor) c3 isetin2 b5 sw1 load switch output inductor connection1 c1 fset frequency setting resistor terminal d4 e4 vfb vfb cv charging voltage feed-back terminal d5 sw2 boost switching terminal inductor connection 2 gnd vbuslim vbuslim sw1 gnd sw2 gnd vfb gnd vfb vbuslim fset gnd downloaded from: http:/// 25 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 thermal reduction characteristics 0 25 75 50 100 125 150 0.5 1.0 1.0w temperature ta [ ] power dissipation pd [w] figure 3 6. . power dissipation (mounted on a 4-layer substrate board) downloaded from: http:/// 26 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes 1. rever se -connection of power supply connecter connecting the power supply in reverse polarity can damage th e ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 2. power supply line design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digit al and analog blocks to prevent noise in the ground and s upply lines of the digital block from affecting the ana log block. furthermore, connect a capacitor to ground at all power supp ly pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground potential ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sig nal ground caused by large current. also ensure that the ground traces of external components do not cause variation on the ground voltage. the ground lines must be as short and thick a s possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute max imum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board . in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtaine d. the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. inr ush current when power is first supplied to the ic, it is possible tha t the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and d elays, especially if the ic has more than one power supply. th erefore, give special consideration to power coupling capacit ance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may su bject the ic to stress. always discharge capacitors completely afte r each process or ste p. the ics power supply should always be turned off completely before connecting or remo ving it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during a ssembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to grou nd , power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance a nd extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the sma ll charge acquired in this way is enough to produce a significant ef fect on the conduction through the transistor and cause unexpected operation of the ic. so, unless otherwise specifie d, unused input terminals should be connected to the pow er supply of ground line. downloaded from: http:/// 27 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes C continued 12. regarding the input pins of the ic this monolithic ic contains p+ isolation and p substrate l ayers between adjacent elements in order to keep them isol ated. p-n junctions are formed at the inters ec tion of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. th e operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physi cal damage. therefore, conditions that cause these diode s to operate, such as applying a voltage lower than the gnd v oltage to an input pin (and thus to the p substrate) should be avoided. figure 37. example of monolithic ic structure 13. thermal shutdown circuit (tsd) this ic has a built-in thermal shutdown circuit that preve nts heat damage to the ic. normal operation should always b e wit hin the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd thre shold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 14. thermal consideration use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. 15. capacitor between logi c output and gnd the logic outputs are vbusok, pgood, isetout1 and isetout2. with a large capacitor connected between logic output and gnd, it is possible that the logic output will sho rt to 0v or gnd and will cause the current from the capacitor to flow in to the logic output, causing damage to ic . the capacitor between logic output and gnd must be 0.1f or less. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:/// 28 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 8664 ordering information b d 8 6 6 4 g w - e 2 part number package gw: ucsp75m2 packaging and forming specification e2: embossed tape and reel b d 8 6 6 5 g w - e 2 part number package gw: ucsp75m2 packaging and forming specification e2: embossed tape and reel b d 8 6 6 8 g w - e 2 part number package gw: ucsp75m2 packaging and forming specification e2: embossed tape and reel marking diagr am s part number marking package orderable part number bd8664 gw ucsp75m2 bd 866 4 gw - e2 bd8665gw ucsp75m2 bd 8665gw- e2 bd8668 gw ucsp75m2 bd 8668gw- e2 top view side view 8668 downloaded from: http:/// 29 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimension s, tape and reel information package name ucsp75m2 ( bd8664gw ) < tape and reel information > tape embossed carrier tape quantity 3000 p cs direction of feed e2 the direction is the pin 1 of product is at the upper lef t when you hold reel on the left hand and you pull out the tape on the right hand downloaded from: http:/// 30 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimension s, tape and reel information package name ucsp75m2 ( bd8665gw ) < tape and reel information > tape embossed carrier tape quantity 3000 p cs direction of feed e2 the direction is the pin 1 of product is at the upper lef t when you hold reel on the left hand and you pull out the tape on the right hand downloaded from: http:/// 31 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimension s, tape and reel information package name ucsp75m2 ( bd8668gw ) < tape and reel information > tape embossed carrier tape quantity 3000 p cs direction of feed e2 the direction is the pin 1 of product is at the upper lef t when you hold reel on the left hand and you pull out the tape on the right hand downloaded from: http:/// 32 / 32 bd8664gw bd8665gw bd8668gw tsz02201-0a1a0az00130-1-2 7.jul.2015 rev.002 ? 20 15 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 revision history date revision changes 17.dec.2014 00 1 new release 7.jul.2015 002 condition of ocp is added in pgood function explanation.(pp16-1 7) downloaded from: http:/// datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
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